edd_jedi wrote:Good effort so far. Obviously try this at your own risk but I have had good success using steam to flatten cards. Hold it above a boiling kettle for a few seconds until it goes slightly floppy, and then immediately put it under some weight until it dries. I have significantly flattened 3 MOCs using this technique.
Thank you for this confidence Edd. Has it affected the bubble or glue on bubble at all? Any lifting in the slightest?
Yes, Richard I thought it would look fine in the GW case but it would still have a bend.